Thsinde – LGA1700-BCF Intel12 generation cpu Bending correction fixing buckle with TF7 thermal grease Red

Description

Size: L54mm*W 70mm*H 6mm Material: Aluminum alloy Weight: 20g (55g for all parts) Accessories: L-shaped screwdriver*1, TF7 thermal paste*1 CPU bend correction Installation seamless, full range of adjustment Aluminum alloy anodizing process This product is only suitable for intel12 generation chips, the motherboard CPU socket is LGA1700 chipset, H610 B660 Z690 series Different experience, demand improvement The original buckle is used, so that the buckle strength is in the middle of the CPU, and the CPU cover support point is slightly worn. The LGA1700-BCF has been tested for thousands of times, and the pressure is adjusted and the force is uniform. Does not wear out the CPU cover even after several installations. Made of high-precision CNC al-aluminum, as well as anodized and frosted paint, various processes, a total of 4 colors (red, silver, black, gray) Precise positioning, avoiding capacitors and electronic components. Using the original LOTES standard specifications of insulation