27pcs Universal bga Stencils Stencils Kit Direct Heat Assortment for bga Soldering Reballing

Description

These stencils are made of high quality 304 stainless steel, for long service life. They can be heated by the hot air machine, and not easy to deform when heated. Cooperating with ordinary air gun, manual reballing can be done, no need to buy another reballing rig. The area of the stencil is matched with the area of ??the BGA chip, which can reduce the wastage of the solder ball.However, for the chip that the solder ball alignment is uneven, or different spacing chips, this stencil is not applicable. It is easy and quick to reball BGA IC, useful and economical accessories for BGA soldering. Important Notes: 1. Lead solder ball melting point 183⊥, SN63PB37 alloy (63% tin, 37% lead). 2. Lead-free solder ball melting point 217⊥, SN96.5AG3CU0.5 alloy (96.5% tin, 3% silver, 0.5% copper). 3. For good solder balls, the content of tin and silver is normal. The melting point is normal. 4. When heated directly with the air gun, pay attention to the temperature setting of the air gun. It does